ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,070, issued on Aug. 4, was assigned to Alps Alpine Co. Ltd. (Japan). "Display device" was invented by Seiki Sugisawa (Miyagi-ken, Japan), Na... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,071, issued on Aug. 4, was assigned to TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) Co. LTD. (Xiamen, China). "Display panel and di... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,072, issued on Aug. 4, was assigned to VueReal Inc. (Waterloo, Canada). "Self-aligned vertical solid state devices fabrication and integrati... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,073, issued on Aug. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Power architecture with dual core advance substrate" w... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,074, issued on Aug. 4, was assigned to Xiamen PVTECH Co. Ltd. (Xiamen, China). "Light-emitting diode light source having high luminous effic... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,075, issued on Aug. 4, was assigned to BARCO N.V. (Kortrijk, Belgium). "Light emitting modules with optical data transmission" was invented ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,076, issued on Aug. 4, was assigned to BOE MLED Technology Co. Ltd. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Display module a... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,077, issued on Aug. 4, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.). "Method of making a fan-out semiconductor assembly with an... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,078, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Redistribution structure with copper ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,079, issued on Aug. 4, was assigned to SJ Semiconductor(Jiangyin) Corp. (JiangSu, China). "Fan-out system-level packaging structure and pack... Read More